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ST3DV520
High bandwidth analog switch with 16-to-8 bit MUX/DEMUX
Preliminary Data
Features

Low RON: 5.5 typical VCC operating range: 3.0 to 3.6 V Low current consumption: 20 A ESD HBM model: > 2 kV Channel on capacitance: 7.5 pf typical Switching time speed: 9 ns Near to zero propagation delay: 250 ps Very low cross talk: -40 db at 250 MHz Bit-to-bit skew: 200 ps > 450 MHz -3db typical bandwidth Package: QFN56 Pb free
QFN56
Description
The ST3DV520 is a 16-to-8 bit bidirectional multiplexer/demultiplexer low RON and high bandwidth switch suitable for analog video applications. The ST3DV520 supports high definition (HD) analog video switching standards and is also suitable for general purpose switching that requires high signal integrity. The device is designed for very low crosstalk, low bit-to-bit skew and low I/O capacitance. The signal from each input is multiplexed into one of two selected outputs while the unselected switch goes to HI-Z status.
Table 1.
Device summary
Order code ST3DV520QTR Package QFN56 Packing Tape and reel
October 2008
Rev 2
1/10
www.st.com 10
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
Pin description
ST3DV520
1
Pin description
Figure 1. Pin connection (top through view)
Table 2.
Pin description
Pin number Symbol A, B, C, D, E, F, G, H A0, B0, C0, D0, E0, F0, G0, H0 A1, B1, C1, D1, E1, F1, G1, H1 SEL N/C VDD GND Name and function 8 bit bus 8 bit multiplexed to bus 0 8 bit multiplexed to bus 1 Bus switch selection Not connected Supply voltage Ground
2, 3, 7, 8, 11, 12, 14, 15 31, 32, 36, 37, 42, 43, 47, 48 29, 30, 35, 40, 41, 45, 46 17 5, 19, 20, 22, 23, 25, 26, 51, 52, 54 4, 10, 18, 27, 38, 50, 56 1, 6, 9, 13, 16, 21, 24, 28, 33, 39, 44, 49, 53, 55
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ST3DV520 Figure 2. Input equivalent circuit
Pin description
AM00755V1
Table 3.
Switch function table
SE L H Function 8 bit bus to 8 bit multiplexed bus 0 8 bit bus to 8 bit multiplexed bus 1
3/10
Maximum rating
ST3DV520
2
Maximum rating
Stressing the device above the rating listed in the "Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.
2.1
Absolute maximum rating
Table 4. Absolute maximum ratings
Parameter Supply voltage to ground DC input voltage DC control input voltage DC output current(1) Value -0.5 to 4 -0.5 to 4 -0.5 to 4 120 0.5 -65 to 150 300 Unit V V V mA W C C
Symbol VCC VI VIC IO PD Tstg TL
Power dissipation Storage temperature Lead temperature (10 sec)
1. If VIO x IO does not exceed the maximum limit of PD.
Table 5.
Symbol VIH VIL VIK IIH IIL
DC electrical characteristics (TA = -40 to 85C, VCC = 3.3 V 10%)
Parameter Voltage input high Voltage input low Clamp diode voltage Input high current Input low current Test conditions High level guaranteed Low level guaranteed VCC = 3.6 V, IIN = -18 mA VCC = 3.6 V, VIN = VCC VCC = 3.6 V, VIN = GND VCC = 0 V, A to H V = 0 V, A0 to H0 and A1 to H1 3.6 V VCC = 3.0 V, VIN = 1.5 to VCC IIN = -40mA 5.5 Min 2 -0.5 -0.8 0.8 -1.2 5 5 Typ Max Unit V V V A A
IOFF
Power down leakage current
5
A
RON
Switch ON resistance(1)
7.5
4/10
ST3DV520 Table 5.
Symbol RFLAT
Maximum rating DC electrical characteristics (TA = -40 to 85C, VCC = 3.3 V 10%) (continued)
Parameter ON resistance flatness(1)(2) ON resistance match between channel RON = RONMAX-RONMIN (1)(3) Test conditions VCC = 3.0 V, VIN at 1.5 and VCC IIN = -40mA VCC = 3.0 V, VIN = 1.5 to VCC IIN = -40mA Min Typ 0.8 Max Unit
RON
0.5
1
1. Measured by voltage drop between channels at indicated current trough the switch. ON resistance is determined by the lower of the voltage. 2. Flatness is defined as the difference between the RONMAX and RONMIN of ON resistance over the specified range. 3. RON measured at same VCC, temperature and voltage level.
Table 6.
Symbol CIN COFF CON
Capacitance specifications (TA = 25C, f = 1 MHz)
Parameter Input capacitance(1) Port x0 to Port x1, switch off Capacitance switch on (x to x0 or x to x1) Test conditions VIN = 0 V VIN = 0 V VIN = 0 V Min Typ 2 4 7.5 Max 3 6 11 Unit pF pF pF
1. x = A to H, x0 = A0 to H0, x1 = A1 to H1
Table 7.
Symbol ICC
Power supply characteristics (TA = -40 to 85C)
Parameter Quiescent power supply Test conditions VCC = 3.6 V VIN = VCC or GND Min Typ 150 Max 500 Unit A
Table 8.
Symb ol Xtalk OIRR BW
Dynamic electrical characteristics (TA = -40 to 85C, VCC = 3.3V 10%)
Parameter Test Conditions RL= 100 , f = 250 MHz RL= 100 , f = 250 MHz RL= 100 Min Typ -40 -36 450 Max Unit dB dB MHz
Crosstalk Off isolation -3dB bandwidth
5/10
Maximum rating
ST3DV520
Table 9.
Symb ol tPD tPZH, tPZL tPHZ, tPLZ
Switching characteristics (TA = -40 to 85C, VCC = 3.3V 10%)
Parameter Test conditions VCC = 3 V to 3.6 V VCC = 3 V to 3.6 V VCC = 3 V to 3.6 V 0.5 0.5 Min Typ 0.25 6.5 6.5 9 8.5 Max Unit ns ns ns
Propagation delay Line enable time, SE to x to x0 or x to x1 Line disable time, SE to x to x0 or x to x1
Output skew between tSK(O) center port to any other port Skew between opposite tSK(P) transition of the same output (tPHL, tPLH)
Note 4: x = A to H, x0 = A0 to H0, x1 = A1 to H1.
VCC = 3 V to 3.6 V
0.1
0.2
ns
VCC = 3 V to 3.6 V
0.1
0.2
ns
Figure 3.
Bandwidth
Figure 4.
Schematic bandwidth
6/10
ST3DV520
Package mechanical data
3
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. QFN56 (11 x 5 mm) package outline
7576329-A
7/10
Package mechanical data
ST3DV520
Table 10.
Symbol
QFN56 (11 x 5 mm) mechanical data
millimeters Min Typ 0.75 Max 0.80 0.05 0.20 0.20 10.90 8.30 0.25 11.00 8.40 9.50 4.90 2.30 5.00 2.40 3.50 0.50 0.30 0.40 0.50 0.012 5.10 2.50 0.193 0.091 0.30 11.10 8.50 0.008 0.429 0.327 0.008 0.010 0.433 0.331 0.374 0.197 0.094 0.138 0.020 0.016 0.020 0.201 0.098 0.012 0.437 0.335 Min 0.028 inches Typ 0.030 Max 0.031 0.002
A A1 A3 b D D2 D3 E E2 E3 e L
0.70
Figure 6.
Footprint recommendation
8/10
ST3DV520
Revision history
4
Revision history
Table 11.
Date 12-Jun-2007 09-Oct-2008
Document revision history
Revision 1 2 Initial release. Modified: title and pinout configuration. Added: Figure 6: Footprint recommendation on page 8. Changes
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ST3DV520
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